• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Mounting device (1) for an electronic component (2) in a vehicle headlight, wherein the electronic component (2) comprises an optical active surface on a front side and a thermal effective surface and electrical contacts on a rear side facing away from the front, and: 3) with a mounting position for the electronic component, as well as an opening located in the region of the mounting position (31), through which access to the optical active surface of the electronic component (2) is possible, wherein the electronic component (2) with its front side on the base body (3) rests, - a printed circuit board (4) to which the electronic component (2) is connectable via their electrical contacts and which has an opening (41) through which access to the thermal effective surface of the electronic component (2) is possible , - A heat sink (5) which is arranged on the thermal effective surface of the electronic component (2) and at the base body is fastened, - at least one resilient spacer (6) which is arranged between the circuit board (4) and the base body (3).
    公开号:AT518266A4
    申请号:T50128/2016
    申请日:2016-02-24
    公开日:2017-09-15
    发明作者:Mayer Matthias；Mitterlehner Stefan
    申请人:Zkw Group Gmbh；
    IPC主号:
    专利说明:

    Mounting device for an electronic component
    The invention relates to a mounting device for an electronic component in a vehicle headlight, wherein the electronic component comprises an optical active surface on a front side and a thermal active surface and electrical contacts on a rear side facing away from the front side.
    In the development of the current headlamp systems is increasingly the desire in the foreground to project a high-resolution as possible on the road surface, which can be quickly changed and adapted to the respective traffic, road and lighting conditions. The term "carriageway" is used here for a simplified representation, because of course it depends on the local conditions, whether a photo is actually on the roadway or even extends beyond.In principle, the photograph is based on a projection on a vertical surface according to the relevant standards relating to automotive lighting technology.
    In order to meet this stated need, among other things, headlamps have been developed in which a variably controllable reflector surface is formed from a plurality of micromirrors and reflects a light emission generated by a light source in the emission direction of the headlamp. Such lighting devices are advantageous in vehicle because of their very flexible light distribution, as for different lighting areas, the illumination can be controlled individually and any light distribution can be realized, such as a low beam light distribution, a cornering light distribution, a city light distribution, a motorway light distribution , a bend light distribution, a high beam light distribution or the image of glare-free high beam. For the micromirror arrangement, the so-called Digital Light Processing (DLP®) projection technology is used, in which images are generated by modulating a digital image onto a light beam. In this case, the light beam is divided into partial areas by a rectangular arrangement of movable micromirrors, also referred to as pixels, and then reflected pixelwise, either into the projection path or out of the projection path.
    The basis for this technique is an electronic component that contains the rectangular array in the form of a matrix of mirrors and their driving technique and is referred to as "Digital Micromirror Device" (DMD).
    In a DMD microsystem is a surface light modulator (Spatial Light Modulator, SLM), which consists of matrix-like micro-mirror actuators, that is tiltable reflective surfaces, for example, with an edge length of about 16 μιη. The mirror surfaces are designed to be movable by the action of electrostatic fields. Each micromirror is individually adjustable in angle and usually has two stable end states, which can be changed within a second up to 5000 times. The number of mirrors corresponds to the resolution of the projected image, where a mirror can represent one or more pixels. Meanwhile, DMD chips with high resolutions in the megapixel range are available. The underlying technology for adjustable mirrors is Micro-Electro-Mechanical Systems (MEMS) technology. While the DMD technology has two stable mirror states, and by modulating between both stable states, the reflection factor can be set, the "Analog Micromirror Device" (AMD) technology has the property that the individual mirrors can be set in variable mirror positions. which are each in a stable state.
    A typical micromirror component comprises a housing, on its front side, behind an optical viewing window, which is arranged matrix of mirrors. The optical interface area of such a micromirror device is understood to be the active mirror surface of the device, that is to say the total area formed by all the individual micromirrors The electrical contacts are usually located in the back of the housing Area ("electrical interface area") arranged around a central area, which is provided for connection of a cooling device. The thermal interface area of such a micromirror component is understood to be the area on the rear side of the component which is provided for mounting a heat sink.
    Often, the micromirror component is incorporated in a so-called Ceramic Land Grid Array (CLGA) module, an integrated circuit interconnect system. In the LGA system, the integrated circuit terminals on its underside are in the form of a grid array LGA processors are typically mounted on pedestals that incorporate spring-loaded contacts, resulting in less mechanical stress on the contacts, and the ceramic body of the CLGA is designed specifically for high operating temperatures.
    In addition to the mechanical load forces that may arise during the assembly of the individual components, during or while the vehicle is moving, mechanical load forces such as vibrations or driving situations may result in tensile or compressive forces acting on all components in the vehicle. There is therefore the requirement that the components are designed on the one hand such that mechanical load forces have no influence on their function or their arrangement with each other. On the other hand, the components must not be impaired in terms of stability or service life, such as caused by high temperature differences mechanical load forces due to different material expansions of adjacent different materials at and within the components.
    An object of the present invention is to provide a mounting device for an electronic component in a vehicle headlight, which supports the basic optical function of the vehicle headlight by the inserted electronic component, as well as their stable, mechanical attachment as well as the connection of the optical, electrical and thermal system components allowed. It should be noted that no mechanical load forces may act on the connections. At the same time, easy maintenance of the components is to be made possible.
    This object is achieved with a vehicle headlamp of the type mentioned above in that the mounting device comprises: a base body with a mounting position for the electronic component, and an opening located in the region of the mounting position, through which access to the optical
    Working surface of the electronic component is possible, wherein the electronic component is located with its front side on the base body, - a printed circuit board to which the electronic component is connectable via the electrical contacts and which has an opening through which access to the thermal effective surface of the electronic component is possible - a heat sink, which is arranged on the thermal active surface of the electronic component and can be fastened to the base body, - at least one resilient spacer, which is arranged between the circuit board and the base body.
    By access to an optical or thermal active surface is meant that the respective active surface can be reached through an opening in either the main body or in the circuit board or the electronic component with the active surface can protrude through the opening to allow the effect of the active surface. The optical active surface generates its effect by reflection of light that is incident and is reflected according to the control by the electronic component again. The opening ensures that the path of the incident and reflected light is not affected. The thermal effective surface generates its effect by dissipating heat that occurs in the electronic component. To improve the effect, a heat sink may additionally be mounted on the thermal effective surface. The heat is caused on the one hand by the power loss of the electronics of the electronic component, but also by the incident on the optical effective surface and not reflected light.
    Due to the mounting device according to the invention ensures that the electronic component is suitably mounted for the function of the vehicle headlamp, also can be suitably cooled and mechanically no load forces acting on the circuit board, since the circuit board is mounted resiliently. In addition, the assembly of the vehicle headlamp is very simple, since in each case a fine adjustment can be made when assembling the individual components, for example, to accomplish an alignment of the electronic component to a light source or imaging optics. By the connecting element, all components are already held together, but still adjustable to some extent.
    The arrangement ensures, when the printed circuit board and the heat sink are separate components from each other, that no mechanical load forces act on the circuit board, but there is still a direct contact between the heat sink and the electronic component for heat transfer.
    The reduction of the mechanical loading forces is also achieved by connecting only materials with similar coefficients of expansion directly to each other, otherwise they are connected only by resilient connections.
    If the printed circuit board and the base body, preferably by means of a connecting element, connected to each other via the resilient spacer and held at a distance, it is ensured that the resiliently executed spacer is secured against slipping during assembly, as this fixed, for example, as a ring around the connecting element is.
    The fasteners may be screws, but may also be connectors, rivets, glued joints or the like. Screws as detachable and reusable connections are easy to maintain the mounting device, connectors have as solid connections on the other hand cost advantages.
    If at least one second resilient spacer is arranged between the printed circuit board and the heat sink, then the printed circuit board is fixed between two resilient spacers and very well damped against vibrations of the headlight.
    By using an analog or digital micromirror array as an electronic component, a particularly advantageous embodiment of the optical function of the vehicle headlight results.
    In the mounting device according to the invention said opening in the base body allows access to the optical effective surface of the electronic component, i. the matrix of mirrors in the component is used for the other components of the
    Illuminating device visible and irradiated by a light source light can enter and exit through the opening and be reflected on the optical effective surface.
    The circuit board advantageously also has an opening through which a heat sink can be extended and allows access to the thermal effective area of the electronic component in order to attach a heat sink there.
    The invention and further advantages will be described in greater detail below with reference to non-limiting exemplary embodiments, which are illustrated in the attached drawings. The drawings show:
    1 is a view on a chip top of an electronic component according to an embodiment of the invention in the form of a DLP chip,
    2 shows a view of a chip underside of the electronic component,
    3 is a perspective view of a first side of an embodiment of a vehicle headlamp with a mounting device according to the invention,
    4 is an exploded view of the headlight from the first side,
    5 is an exploded view of important components of the fixture of the headlight from a second side,
    6 is a bottom view of the headlamp with the location of the cutting planes A-A and B-B,
    7 shows the headlight in a sectional view according to the sectional plane A-A of FIG. 6,
    8 shows the headlight in a sectional view according to the sectional plane B-B of FIG. 6.
    With reference to FIGS. 1 to 8, embodiments of the invention will now be explained in more detail. In particular, important parts are shown in a headlamp, it being understood that a headlamp still contains many other, not shown parts that allow a meaningful use in a motor vehicle, in particular a car or motorcycle.
    In the figures, the components of a mounting device 1 for an electronic component 2 in a vehicle headlight in an overview or in various perspectives and sections are shown. In the figures, only a representative reference numeral for a respective component is drawn, even if the same component is executed several times.
    FIGS. 1 and 2 show, according to the invention, an electronic component 2 in the form of a digital micromirror array (DLP® chip). The electronic component 2 has an optical active surface 21 (micromirror array) on a front side and a thermal active surface 22 as well as circularly arranged electrical contacts 23 on a rear side facing away from the front side. Furthermore, adjustment holes are recognizable. In this example, the electronic component 2 is an analog or digital micromirror array.
    The chip upper side or the chip bottom side in FIGS. 1 and 2 does not correspond to the views of the entire mounting device according to FIGS. 3 to 8.
    In Fig. 3 to Fig. 5, the structure of the holder device 1 according to an embodiment is shown.
    The electronic component 2 is mounted on a base body 3, in a mounting position provided for this purpose. The base body 3 has in the region of the mounting position an opening 31, through which access to the optical active surface 21 of the electronic component 2 is possible. The access can be carried out, for example, such that the electronic component 2 projects through the opening 31. As a result, the matrix of mirrors in the electronic component 2 becomes optically accessible or visible to other components of the illumination device, which makes it possible for the light irradiated by a light source to be reflected via the optical active surface in the emission direction of the headlight. In addition, the electronic component 2 rests with its front side on the main body 3.
    A printed circuit board 4, with which the electronic component 2 can be connected via its electrical contacts, has an opening 41 through which access to the thermal active surface 22 of the electronic component 2 is possible.
    A heat sink 5 is arranged on the thermal active surface 22 of the electronic component 2 and can be attached to the base body.
    A plurality of resilient spacers 6 are arranged between the circuit board 4 and the base body 3. The spacers 6 may be annular, in particular toroidal or hollow cylindrical. Several connecting elements 7 set the heat sink 5 on the base body 3. The connecting elements 7 are screws in this example, but may also be connectors, rivets, glued joints or the like. In addition, they connect the circuit board 4 with the base body 3 via resilient spacers 6 elastically. In addition, 5 second resilient spacers 8 are arranged between the circuit board 4 and the heat sink.
    The electronic component 2 lies with its front side on the main body 3 and is fixed with the connecting elements 7 and the heat sink 5. When using a screw as a connecting element 7, a thread may be provided in the base body 3. In other words, the electronic component 2 is clamped between the main body 3 and the heat sink 5, wherein the clamping force is applied via the connecting elements 7 and the connection is established.
    A projection optical module 10, which comprises projection optics for beam shaping, can be fastened to the mounting device 1. Furthermore, a light source opening 11 and a projection optical opening 12 are provided on the mounting device 1 in order to bring a light source and a projection optical unit of a vehicle headlight into an optical arrangement together with the electronic component 2. The projection optics of the vehicle headlight can be fastened to the projection device 1 provided in the projection optical module 10 provided for this purpose. The light generated by the light source in a light source module 9 is irradiated in the direction of the electronic component 2 to be reflected on the optical active surface 21 in the direction of the projection optics.
    6 shows the mounting device 1 with the main body 3 and the printed circuit board 4 and the heat sink 5 in a view from below with the position of sectional planes A-A and B-B. The sectional plane A-A passes through the connecting elements 7, the sectional plane B-B through the heat sink. 5
    FIG. 7 shows a cross-section of the holding device 1 in a sectional plane A-A of FIG. 6, wherein the sectional plane A-A runs through the connecting elements 7. On the circuit board 4, the electronic component 2 is mounted on a mounting base 24. The circuit board 4 and the heat sink 5 are held on the main body 3 by the connecting elements 7 and the resilient spacers 6 and 8 at a defined distance. On the back of the electronic component 2, the heat sink 5 is arranged.
    FIG. 8 shows a cross section of the holding device 1 in a sectional plane B-B of FIG. 6, the sectional plane B-B passing through the heat sink 5. The heat sink 5 is fastened to the main body 3 by the connecting elements. It can be seen how the heat sink 5 is arranged on the electronic component 2, wherein the heat sink 5 is inserted through the mounting base 24. The resilient spacers 6 and 8 fix the circuit board 4 according to the invention such that no mechanical loading forces act on them.
    The following reference numerals are used below: 1 mounting device 2 electronic component 21 optical active surface of the electronic component 22 thermal active surface of the electronic component 23 electrical contacts of the electronic component 24 mounting base for the electronic component 3 main body 31 opening for electronic component in the main body 4 PCB 41 opening for electronic component in circuit board 5 heat sink 6 first resilient spacer 7 connecting element 8 second resilient spacer 9 light source module 10 projection optics module 11 light source opening 12 projection optics opening
    权利要求:
    Claims (4)
    [1]
    claims
    1. Mounting device (1) for an electronic component (2) in a vehicle headlight, wherein the electronic component (2) has an optical active surface (21) on a front side and a thermal active surface (22) and electrical contacts (23) on one of the front side comprising a base body (3) with a mounting position for the electronic component, and an opening (31) located in the region of the mounting position, through which access to the optical active surface (21) of the electronic component (2) is possible is, wherein the electronic component (2) lies with its front side on the base body (3), - a printed circuit board (4), with which the electronic component (2) is connectable via their electrical contacts and which has an opening (41), by which access to the thermal effective surface (22) of the electronic component (2) is possible, - a heat sink (5) on the thermal effective surface (22) of the e lektronischen component (2) is arranged and can be fastened to the base body, - at least one resilient spacer (6) which is arranged between the circuit board (4) and the base body (3).
    [2]
    2. Apparatus according to claim 1, characterized in that the printed circuit board (4) and the base body (3), preferably by means of a connecting element (7), in particular a screw or connector, via the resilient spacer (6) connected to each other and at a distance are held.
    [3]
    3. Apparatus according to claim 1 or 2, characterized in that between the printed circuit board (4) and the heat sink (5) at least a second resilient spacer (8) is arranged.
    [4]
    4. Device according to one of claims 1 to 3, characterized in that the electronic component (2) is an analog or digital micromirror array.
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50128/2016A|AT518266B1|2016-02-24|2016-02-24|Mounting device for an electronic component|ATA50128/2016A| AT518266B1|2016-02-24|2016-02-24|Mounting device for an electronic component|
    JP2018542191A| JP6665308B2|2016-02-24|2017-02-06|Holding device for electronic components|
    CN201780013053.9A| CN108700271B|2016-02-24|2017-02-06|Holding device for electronic components|
    US16/078,109| US10429024B2|2016-02-24|2017-02-06|Retaining device for an electronic component|
    PCT/AT2017/060021| WO2017143372A1|2016-02-24|2017-02-06|Retaining device for an electronic component|
    KR1020187025467A| KR102095879B1|2016-02-24|2017-02-06|Holding device for electronic components|
    EP17706402.9A| EP3387323B1|2016-02-24|2017-02-06|Vehicle headlamp comprising a retaining device for an electronic component|
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